| 摘要 |
<p>A low-melting lead-free solder suitable for soldering electronic parts, comprising at least one of 7-10 wt.% Zn, 0.01-1 wt.% Ni, 0.1-3.5 wt.% Ag and 0.1-3 wt.% Cu, and an arbitrary additive of at least one of 0.2-6 wt.% Bi, 0.5-3 wt.% In and 0.001-1 wt.% P, with Sn for the rest. Alternatively, the lead-free solder substantially comprises 2-10 wt.% Zn, 10-30 wt.% Bi, and 0.05-2 wt.% Ag, and an arbitrary additive of 0.001-1 wt.% P, with Sn for the rest. These solders have a tensile strength of not lower than 10 kgf/mm2 and an elongation of not less than 10 %.</p> |
