发明名称 |
Heat actuated fuse apparatus with solder link |
摘要 |
<p>An apparatus for protecting circuitry includes a heat actuated fuse which opens at a predetermined temperature and a resistive device disposed proximate the fuse for heating the fuse in response to an electrical current passed through the device. The fuse includes first and second electrodes bridged by a solder link which melts at the predetermined temperature and retreats to the electrodes. A quantity of flux-containing material is disposed on the link to promote rapid and complete retreat of the solder when the fuse is actuated.</p> |
申请公布号 |
EP0517306(B1) |
申请公布日期 |
1997.04.09 |
申请号 |
EP19920201522 |
申请日期 |
1992.05.29 |
申请人 |
MICROELECTRONIC MODULES CORPORATION |
发明人 |
DOERRWAECHTER, BERNHARD |
分类号 |
H01H85/04;H01H85/00;H01H85/02;H01H85/046;H01H85/46;H05K1/00;H05K3/28;H05K3/34;(IPC1-7):H01H37/76 |
主分类号 |
H01H85/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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