发明名称 Heat actuated fuse apparatus with solder link
摘要 <p>An apparatus for protecting circuitry includes a heat actuated fuse which opens at a predetermined temperature and a resistive device disposed proximate the fuse for heating the fuse in response to an electrical current passed through the device. The fuse includes first and second electrodes bridged by a solder link which melts at the predetermined temperature and retreats to the electrodes. A quantity of flux-containing material is disposed on the link to promote rapid and complete retreat of the solder when the fuse is actuated.</p>
申请公布号 EP0517306(B1) 申请公布日期 1997.04.09
申请号 EP19920201522 申请日期 1992.05.29
申请人 MICROELECTRONIC MODULES CORPORATION 发明人 DOERRWAECHTER, BERNHARD
分类号 H01H85/04;H01H85/00;H01H85/02;H01H85/046;H01H85/46;H05K1/00;H05K3/28;H05K3/34;(IPC1-7):H01H37/76 主分类号 H01H85/04
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