发明名称 CONNECTION STRUCTURE OF ELECTRONIC PARTS AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To improve connection reliability increasing the number of processes at the time of connecting fellow connection terminals of a minute pitch by using an anisotropic conductive material. SOLUTION: At the time of connecting fellow connection terminals 3, 4 of a minute pitch by using an anisotropic conductive material, an uneven part 6 having a smaller difference in interval and height than a diameter of a conductive particle 1 is formed on the top of a projection 2 for connection so as to check a leak of conductive particles 1 by this uneven part 6 and a surplus of resin and air bubbles generating during heating leak outside of a connection terminal. Thereby, conductive particles 1 and only resin of the anisotropic conductive material remain in the connection part so as to improve connection reliability. The uneven part 6 can be easily formed by formation of a specific pattern 5a and applying electrolytic soldering.
申请公布号 JPH0997814(A) 申请公布日期 1997.04.08
申请号 JP19950251563 申请日期 1995.09.28
申请人 NEC CORP 发明人 KAI TAKANOBU
分类号 G02F1/1345;G02F1/136;G02F1/1368;H01L21/60;H05K3/32;H05K3/34;H05K3/36;H05K3/40 主分类号 G02F1/1345
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