| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition for sealing electronic components, which can give a cured film being excellent in dimensional stability and improved in the ability to prevent water from penetrating from outside. SOLUTION: This resin composition for sealing electronic components essentially consists of an epoxy resin, a phenolic resin curing agent, a cure accelerator, an inorganic filler and zeolite. The structure of this zeolite is represented by the formula: xM2/n O.Al2 O3 .ySiO2 Zh2 O (wherein X=0.1-2.0; y=1.0-200; z=0-100 and M is an alkali metal or an alkaline earth metal; and (n) is its valence). Its maximum diameter is 150μm or below, and its content is 3-30wt.% based on the entire composition.
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