发明名称 Solventless resin composition having minimal reactivity at room temperature
摘要 A resin composition is provided that is suitable for impregnating sheet material, including fabrics, films, paper and tapes of the type employed to form prepregs, such as tapes used to form electrical insulation layers on electrical components. The resin composition includes a solid or semi-solid epoxy resin having an epoxide functionality of at least 2.5, a metal acetylacetonate for catalyzing the epoxy resin, and an accelerator of bisphenol A-formaldehyde novolac catalyzed by an acidic catalyst and having a hydroxyl equivalent weight of 120. The resin composition is essentially unreactive at room temperature and at elevated temperatures sufficient to enable permeation of the sheet material by the resin in its manufacture, is essentially unreactive at temperatures required to remove moisture and volatiles during processing of articles wrapped or taped with the sheet material, and cures at a higher temperature without adversely affecting the cure characteristics of the resin composition. The resin composition of this invention achieves the desirable reactivity characteristics noted above, while exhibiting enhanced mechanical, thermal and electrical properties necessary for its use within an electrical insulation composite.
申请公布号 US5618891(A) 申请公布日期 1997.04.08
申请号 US19950413015 申请日期 1995.03.29
申请人 GENERAL ELECTRIC CO. 发明人 MARKOVITZ, MARK
分类号 C08G59/70;C08L63/00;H01B3/40;(IPC1-7):C08F283/00;C08G8/28;B32B27/38 主分类号 C08G59/70
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