发明名称 MANUFACTURE OF SEMICONDUCTOR MEMORY
摘要 PROBLEM TO BE SOLVED: To make it possible to facilitate the process of a storage electrode by forming an interlayer insulating film on an interconnection layer, depositing a conductive electrode material on the insulating film, processing conductive electrode material to simultaneously form the interconnection layers of the charge storage electrode of the cell and out of the cell region. SOLUTION: The method for manufacturing a semiconductor memory comprises the steps of depositing an oxide film 14 as an interlayer insulating film, then opening the storage electrode connecting hole 8c of the cell and the connecting hole 9c of a peripheral circuit part by using lithographic method and etching technology, further forming a groove 15 for the storage electrode of the cell and the interconnection groove 16 of the peripheral circuit by using the lithographic method and the etching technology, then depositing the conductive electrode material, embedding the holes 8c, 9c, 10, the groove 15 for the electrode and the groove 16 for the circuit, and simultaneously forming the interconnection layer 19 of the electrode 18 and the circuit.
申请公布号 JPH0992794(A) 申请公布日期 1997.04.04
申请号 JP19950244114 申请日期 1995.09.22
申请人 TOSHIBA CORP 发明人 SUDO AKIRA;SAWADA SHIZUO
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/108 主分类号 H01L27/04
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