| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive polyimide resin capable of heating treatment at a low temp., having satisfactory film characteristics and excellent in adhesion to a substrate. SOLUTION: This photosensitive resin compsn. contains polyamic acid ester having a structure represented by formula I (where R2 contains one or more kinds of groups represented by formula II, etc., and a group represented by formula III and the contents of the groups represented by the formulae II, III are 30-99mol% and 1-20mol% of R2 , respectively) and having 170-270 deg.C glass transition temp. after heat treatment and a photopolymn. initiator and/or a photosensitizer as essential components. |
