| 摘要 |
PROBLEM TO BE SOLVED: To effectively and efficiently use an abrasive tape, so as to perform polishing, by providing a second plate arranged parallel to a first plate so that it may be reciprocated in the vertical direction in relation to the axial direction. SOLUTION: When a motor is driven while reciprocating a second plate 42 in the direction of the arrow, an abrasive tape T is brought in contact with a semiconductor wafer with tension. Accordingly, the abrasive tape T is reciprocated and slid with the semiconductor wafer by the reciprocating movement of the second plate 42, abrasive force is lowered, however, constant abrasive force is held since a new abrasive tape T is supplied from a supplying roller 62. The abrasive tape can be made to contribute to polishing by reciprocating the second plate 42. |
