OPTICAL INTEGRATED CIRCUITRY

摘要

Optical integrated circuitry, performing various of the functions associated with electronic integrated circuitry, is described. Fabrication, importantly to achieve high circuit chip density - typically in the range of 106 as including both devices and interconnecting guides - is dependent upon device/spacing dimension miniaturization resulting from fabrication in very thin layers. Typical layer thickness as retained in fabricated devices and guides, of a maximum of the order of a 1/2 wavelength for relevant photon flux, results in limitation in cross-talk to permit device design rules of one or a few wavelengths.