发明名称 MANUFACTURE OF METAL BASE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a metal-plated laminated board which is excellent in surface smoothness, high in galvanic corrosion resistance, and excellent in drilling processability and capable of coping with wiring of high density. SOLUTION: Thermosetting resin particles which are solid at normal temperatures and uncured are dispersed into inorganic fiber and bonded together with curing binder resin into a resin sheet, and the resin sheet is sandwiched in between a metal base 1 and a wiring board 3, and the above laminate is thermocompressed. The resin sheet. is formed through such a manner that slurry which comprises inorganic fiber and thermosetting resin particles that are solid at normal temperatures and uncured is formed into a sheet, curing binder resin is applied onto the sheet, and the sheet is dried up by heating to cure the curing binder resin.
申请公布号 JPH0974274(A) 申请公布日期 1997.03.18
申请号 JP19950227623 申请日期 1995.09.05
申请人 HITACHI CHEM CO LTD 发明人 MURAI AKIRA;SAKAI HIROSHI;FUKUDA TETSUYA
分类号 B32B15/08;G06K19/077;H05K1/05;H05K3/44 主分类号 B32B15/08
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