| 摘要 |
PROBLEM TO BE SOLVED: To obtain an inexpensive photosensitive resin composition which can be used as a material for the insulating layers in multilayered printed wiring boards, has particularly high resolution and glass transition temperature, can form a desired pattern with reduced exposure to the light, and shows excellent electric properties such as insulating properties and dielectric constant. SOLUTION: This photosensitive resin composition constituting the insulating layers comprises tetraglycidyldiaminodiphenylmethane in which at least one of epoxy groups is acrylic- or methacrylic-modified, photoplymerizing monomers, a photopolymerization initiator, a filler selected from inorganic and organic fillers with an average particle size of 5.0μm-0.1μm, a curing agent and an organic solvent. The acrylic- or methacrylic-modified tetraglycidyldiaminodiphenylmethane is preferably prepared by reaction of 1.0 equivalent amount of tetraglycidyldiaminodiphenylmethane with 0.3-0.8 equivalent amount of an unsaturated monobasic acid. |
