发明名称 DRILLING METHOD OF PRINTED CIRCUIT BOARD AND DRILLING DATA PREPARING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for drilling a printed circuit board capable of reducing consumption of a drill and capable of the drilling operation at a low cost, and a drilling data preparing device to prepare the drilling data. SOLUTION: Discrimination is made whether or not holes to be formed in each substrate are those of coarse accuracy or highly precise accuracy (S106). The through hole of coarse accuracy is made when no holes of highly precise accuracy are present among the holes constituting individual through holes (S110). The number of the through holes of coarse accuracy is compared with the drilling efficiency number (S112), and when the number of the through holes of coarse accuracy is not less than the drilling efficiency number, the through holes of coarse accuracy are formed using a coarse accuracy drill, while the through holes of highly precise accuracy are formed using a highly precise accuracy drill (S113). When the number of the through holes of coarse accuracy is below the drilling efficiency number, all the through holes are formed by the highly precise drill (S114).
申请公布号 JPH0970800(A) 申请公布日期 1997.03.18
申请号 JP19950251961 申请日期 1995.09.04
申请人 IBIDEN CO LTD 发明人 KOMORI OSAMU
分类号 B23B41/00;B26F1/16;H05K3/00;H05K3/46;(IPC1-7):B26F1/16 主分类号 B23B41/00
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