| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin paste for die bonding which hardly stains a substrate and is excellent in resistance to soldering crack. SOLUTION: This paste contains as the essential components an arom. diepoxy resin liq. at normal temp. and having a hydrolyzable chlorine content of 500ppm or lower, 4,4'-diamino-3,3'-diethyldiphenylmethane as the curative, 0.01-1wt.% (based on the resin) 1,8-diazabicyclo [5,4,0]undecene-7 and/or its salt, 0.05-5wt.% (based on the paste) superfine-particle silica powder having an average size of primary particles of 2-50nm and having silanol groups existing on the surface, and 10-90wt.% (based on the paste) an inorg. filler.
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