| 摘要 |
<p>PROBLEM TO BE SOLVED: To perform thin-type mounting without causing a connection fail such as disconnection or the like. SOLUTION: An Inner lead part 1b is connected to an external electrode of a semiconductor element 10, and further an outer lead part 1a bends an intermediate part of a lead terminal 1 extending outward from an external electrode formation face 10a along the face 10a, toward the side of a side face 10b of the semiconductor element 10. Further, the outer lead part 1a is bent outward along a rear face 10c of the semiconductor element 10. Into a device hole 21 for receiving electronic parts formed on a wire pattern formation face of a circuit substrate 20, the semiconductor element 10 is inserted from its external electrode formation face 10a to be received and arranged.</p> |
