| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve reliability in soldering and moisture resistance, by forming a semi-cured heat-curing resin or a resin film layer with a given curing temperature over a face provided with metallic poles or bumps. SOLUTION: A semiconductor chip 3 is bonded and mounted on a die pad 2 of a copper lead frame 1 with an epoxy-based diebonding adhesive containing silver. A lead frame 1 is put in a mold 4 and encapsulated with an epoxy-based molding material containing molten silica for 90sec at a temperature of 175R deg.C and an after curing step is carried out for 5hr at a temperature of 175 deg.C. A bump connected to an outer circuit is formed at an electrode pad using a solder ball 6. Then, an epoxy-based material containing a molten silica in a solid state at a room temperature is dissolved in a solvent, and a screen printing step is carried out. The solvent is dried at 120 deg.C to form a semi-cured heat- curing resin layer 8 thicker than the bump is formed. As a result, reliability in solder connection and moisture resistance can be improved.</p> |
