Vorrichtung zum Montieren von elektronischen Bauelementen auf Platten

摘要

Electronic components (18) such as chips are attracted to the tip ends of nozzles (15a - 15b) under suction, and mounted on printed-circuit boards (29) when the vacuum condition in the nozzles is broken. The time for breaking the vacuum condition in the nozzles (15a - 15b) is adjusted by a variable time adjusting unit (44) based on angular displacement information of a cam (25) which vertically moves the nozzles (15a - 15b) depending on the selected mounting cycle. Even when a different mounting cycle is selected, time delays are varied to adjust the time for breaking the vacuum condition in the nozzles (15a - 15b) for thereby mounting electronic components (18) accurately and stably on printed-circuit boards (29).