| 摘要 |
FIELD: copper foil manufacture. SUBSTANCE: invention refers to copper electroplated foil of low profile. In agreement with one approach this foil has grain structure oriented randomly and homogeneous in considerable degree which has average size of grains to 10.0 μm. This foil has tensile strength limit within range from 87.000 to 120.000 lb/sq.in measured at 23 C and elongation of 15 to 28% measured at 180 C. Process of foil manufacture includes: flow of electrolyte solution between anode and cathode and application of effective value of voltage between anode and cathode for electrolytic precipitation of copper on cathode. Electrolyte solution carries ions of copper, ions of sulfates, one organic additive or its derivative and concentration of ions of chloride amounts to 1•10, density of current remains within range from 0.1 up to 5.0 A/sq.cm. Process ends with removal of foil from cathode. EFFECT: increased quality of copper foil, improved efficiency of process. |
