Conductive wiring on semiconductor component surface arranging method

摘要

The method involves using conductive wires (2) on the upper surface of a semiconductor component, the wires being in a right-angled coordinate system. The wires in this coordinate system are either parallel to the axes of the coordinate system or at forty-five degrees. The wires are connected to each other via polygonal shaped connection regions (1). The sides of the polygon region are connected with each other at angles greater than ninety degrees, and edge points are provided with a status of parallel connectable, diagonal connectable, or non-connectable. Wires parallel to the coordinate system axes and at an angle of forty-five degrees to the axes are guided to respective parallel and diagonal connectable edges only. No wires are connected to the non-connectable edges.