发明名称 METHOD AND APPARATUS FOR BONDING ELEMENT
摘要 PROBLEM TO BE SOLVED: To facilitate the highly accurate adjustment of the parallelism of an element and an object to be bonded by projecting measuring optical beams on at least two parts of the reference edges of the element and the object to be bonded, and rotating the element and the object to be bonded so that the distances to the reference edges to be measured become equal at the respective irradiated positions. SOLUTION: Two optical beams 13 emitted from a focal-point adjusting device 12 for far and near distances are projected on two right and left parts at the reference edge of an element 2, that is to say, in a rear-side surface 2a. Then, two reflected lights returning to a lens barrel 12c are detected, and an air forceps 1 is rotated so that the respective auto-focused distances become equal to each other. Then, after the focal-point adjusting device 12 for the far and near distances is lowered, two optical beams 13 are projected to the right and left of the reference edge of a lightguide substrate 6, that is to say, in an edge 6a. Then, two reflected lights returning to the lens barrel 12c are detected, and a sample stage is rotated so that the respective auto-focused distances become equal.
申请公布号 JPH0955393(A) 申请公布日期 1997.02.25
申请号 JP19950206184 申请日期 1995.08.11
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 NAKADA HIROSHI;SAWADA YASUSHI
分类号 H01L21/52;G02B6/122;(IPC1-7):H01L21/52 主分类号 H01L21/52
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