| 摘要 |
<p>A solid electrolytic capacitor according to the present invention includes a chip substrate segment (12), a sintered chip (21) of metal powder mounted on an upper surface of the chip substrate segment (12), a solid electrolyte layer (23) formed on the chip (21) in electrical insulation from the metal powder of the chip (21) via a dielectric film (22), a resin coating (25) covering the chip (21) with a portion of the solid electrolyte layer (23) exposed, a cathode terminal electrode film (27) formed in electrical conduction with the exposed portion of the solid electrolyte layer (23), and an anode terminal electrode film (28) formed on the chip substrate segment (12) in electrical conduction with the metal powder of the chip (21). The present invention further provides a process for making a solid electrolytic capacitor which has such a structure. <IMAGE></p> |
