| 摘要 |
PROBLEM TO BE SOLVED: To provide a hybrid printed circuit board which can be manufactured readily and economically and has a plurality of boards of different thermal expansion coefficients. SOLUTION: Several contact pads 14A are formed in a bottom part of a daughter board 14. A contact pad 12A which aligns with the contact pads 14A is formed in an upper surface part of a mother board 12. Solder compound is applied on a mother board by a stencil. A daughter board is attached to a mother board by adopting a standard automatic surface mounting method. |
