| 摘要 |
PROBLEM TO BE SOLVED: To polish a semiconductor wafer with a high throughput and improved reproducibility and uniformity by driving and controlling each arm for moving each head so that the position in radius direction does not change and the arms do not interfere each other on a rotating polishing stand. SOLUTION: A polishing device has a rotary polishing stand 1 and four polishing heads 2 for retaining a semiconductor wafer with recess and projection on a surface and for rotating it, an actuator 4 is provided at the base edge to rock an arm 3 for supporting the polishing head 2 at a loose edge, and a control unit 5 drives and controls the actuator 4, where each head 2 is polished while it is, for example, rocked or slid so that at least the position in radius direction changes on the polishing stand 1 to prevent the arms 3 from interfering with each other. Therefore, semiconductor wafers which are retained at each head 2 are uniformly adjacent on the polishing surface of the polishing stand 1 and a number of wafers can be polished simultaneously. |
