PROCESS TO ENCAPSULATE AN ELECTRONIC COMPONENT, AN ELECTRONIC COMPONENT THUS ENCAPSULATED AND ENCAPSULATED MATERIAL PREPARED THEREFOR.

摘要

The present invention discloses a process to encapsulate an electronic component, particularly an integrated circuit having an encapsulating material, said process being characterized in that it comprises at least the following steps: placing a component to be encapsulated in a mould cavity; introducing the encapsulating material inside the cavity between the mould and component to be encapsulated at high temperature; hardening said encapsulated material; and releasing or removing said encapsulated component from said cavity. The encapsulated material of the present invention comprises 40-65 percent by weight of engineering thermoplastic and 60-35 percent by weight of reactive solvent.