METHOD AND APPARATUS FOR MOUNTING ELECTRONIC COMPONENTS

摘要

A method and an apparatus for mounting electronic components. The apparatus comprises a head (35) having a plurality of nozzles (12, 13) for attracting electronic components and a camera (15) for recognizing the images and postures of the attracted electronic components, and a control portion (1) for recognizing the image of the postures of the electronic components held on the nozzles at an electronic component feed portion (30) by the recognition camera, correcting the posture and controlling the head for mounting the electronic components on a substrate. The main controller (1) includes a sequence selection routine (11) for operating the head by selecting either a first sequence wherein one of the nozzles attracts a component and mounts it continuously and then the other does a similar job for another component or a second sequence wherein one of the nozzles attracts a component, then the other attracts another, and afterward they mount them continuously.