Verfahren zur Montage elektronischer Bauteile auf einem Schaltkreissubstrat und Schaltkreissubstrat mit darauf montierten elektronischen Bauteilen

摘要

In order to electrically connect the projecting electrodes of an LSI with a given wiring pattern on a circuit substrate, at least a portion of the electronic part is covered with a heat-shrinkable film member which in turn is fixedly mounted on the circuit substrate by adhesive at the opposite side or all the sides of the heat-shrinkable film member. When the heat-shrinkable film member is heated, the shrinkage of the heat-shrinkable film member presses the LSI against the circuit substrate under pressure. Thus, the bumps of the LSI can be electrically connected with the wiring pattern on the circuit substrate. Therefore, the LSI can be easily mounted on the circuit substrate or replaced by a new one.