发明名称 Method of making In-containing III/V semiconductor devices
摘要 <p>A semiconductor device comprising In-contg. III-V material is mfd. by: (a) placing a body of the In-contg. III-V material in a reactor chamber; and (b) flowing a gas mixt. of N2 and BCl3 into the chamber and applying microwave power to the gas to form a plasma to remove some of the semiconductor material. The N2/BCl3 ratio is such that the etch rate of the material is at least 50% larger than the etch rate when the ratio is zero, all else being equal.</p>
申请公布号 EP0755069(A1) 申请公布日期 1997.01.22
申请号 EP19960305099 申请日期 1996.07.10
申请人 AT&T IPM CORP. 发明人 HOBSON, WILLIAM SCOTT;REN, FAN;LOPATA, JOHN
分类号 H01L29/73;H01L21/302;H01L21/306;H01L21/3065;H01L21/331;H01L21/338;H01L29/737;H01L29/778;H01L29/812;H01S5/00;(IPC1-7):H01L21/306 主分类号 H01L29/73
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