| 摘要 |
PROBLEM TO BE SOLVED: To inspect the electric characteristics of a BGA package semiconductor element without generating an external appearance failure such as a damage, a recess or a defect on a solder ball. SOLUTION: Test pads for inspecting electric characteristics electrically connected by one to one to terminals of a semiconductor chip are provided on a board where the chip is mounted. In an embodiment, a conductor pattern 1 where the chip is die bonded is extended to the outside from a through hole 2, and a test pad 3 is so formed as not to provide solder resist on the surface of the extension. That is, the pad 3 is provided on the opposite side surface to the solder ball 7 forming surface. This semiconductor element can be inspected for electric characteristics without bringing a probe pin into contact with the ball 7. |
