发明名称 |
Laser slag removal |
摘要 |
A process is provided for removing slag from an aperture in a substrate, comprising the steps of: providing a protective coating on the substrate; drilling a hole through the substrate; and chemically removing slag from the aperture by complete or partial immersion of the substrate into a chemical bath. Additional process steps can include cleaning the stripped substrate and baking the substrate at a high temperature. A base coating can be provided on the substrate to promote adhesion of a chemically resistant coating to the substrate. Additionally, a protective coating can be applied to the chemically resistant coating to protect it during drilling. The chemically resistant layer can be a material, such as gold, that does not oxidize or dissolve when it is exposed to a chemical, such as phosphoric acid. Phosphoric acid can be heated to accelerate slag removal. |
申请公布号 |
US5595668(A) |
申请公布日期 |
1997.01.21 |
申请号 |
US19950417092 |
申请日期 |
1995.04.05 |
申请人 |
ELECTRO-FILMS INCORPORATED |
发明人 |
MADDEN, JR., JEAN D.;KNAPP, CHRISTOPHER H. |
分类号 |
B23K26/38;H01L21/48;H05K1/03;H05K3/00;H05K3/38;H05K3/42;(IPC1-7):H05K3/00 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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