| 摘要 |
PURPOSE: To provide an inexpensive and vacuum integration type of semiconductor manufacture system resistant to vibration. CONSTITUTION: In a semiconductor manufacture system 10 equipped with a plurality of process devices 11 and 12, which processes a semiconductor wafer, and a wafer carriage path 13, where a semiconductor wafer shifting between these process devices 11 and 12 passes, the wafer carriage path 13 has airtight structure by which it is kept at specified vacuum degree while the semiconductor wafer passes the wafer carriage path 13. And, at least one process device out of a plurality of process devices 11 and 12 is a high vacuum process device 11 which processes a semiconductor wafer under high vacuum over specified vacuum degree, and this system is equipped with a load lock device 40 which is arranged between the high vacuum process device 11 and the wafer carriage path 13, and has a semiconductor wafer carried in from the side of the wafer carriage path 13 and transfers the semiconductor wafer to the high vacuum process device 11, raising the vacuum degree. |
