Interconnection between layers of striplines or microstrip through cavity backed slot

摘要

An interconnection between layers of stripline or microstripline in a multilayer microwave circuit assembly, through electromagnetic coupling. The adjacent layers (52 and 54) utilize a common ground plane layer (56), and a U-shaped coupling slot (64) is formed in the common ground plane. To eliminate undesirable coupling to other transmission line modes, the coupling slot is enclosed by a cavity (70) for each layer. The cavity size is selected so that no cavity mode exists, and to prevent formation of unwanted transmission modes. The "U" shape of the slot reduces the size of the cavity. The interconnection can be used with adjacent layers of stripline, microstrip line, or stripline and microstrip line.