| 摘要 |
PURPOSE: To provide a ceramic package on which a wider-size and nearly square chip can be mounted by a method wherein the outer shape of a conventional ceramic package is not changed and a chip mounting part at the inside is changed. CONSTITUTION: A base layer is formed so as to partition a nearly square die bonding region 14 which is turned by a prescribed angle. An intermediate layer is formed in such a way that it is laminated on the base layer, that it forms the die bonding region 14 and that it is provided with an input pad 12A, for wire bonding, comprising an inner edge, with an output part 12B for wire bonding and with a grounding pad 12C for wire bonding. An uppermost layer 13 is formed in such a way that it is laminated on the intermediate layer and that an ordinary sealing margin is formed. |
