发明名称 Polyimide precursor composition for extrusion molding of polyimide, process for preparing it, and process for preparing molded articles of polyimide
摘要 A process for preparing molded articles of a polyimide is provided the steps of melting and extruding, at 50 DEG to 100 DEG C., a polyimide precursor composition for extrusion molding of a polyimide which includes 30 to 60% by weight of a polyimide precursor (c) obtained by reacting an aromatic tetracarboxylic dianhydride or its derivative (a) with an aromatic diamine or its derivative (b) in a good solvent of the polyimide precursor and then depositing the resultant polyimide precursor solution in a poor solvent of the polyimide precursor, 0.1 to 5% by weight of the poor solvent, and 35 to 69.9% by weight of the good solvent, and then heating the molded composition at 250 DEG to 500 DEG C. to imidate the same or its derivative (b) in a good solvent of the polyimide precursor and then depositing the resultant polyimide precursor (c) solution in a poor solvent of the polyimide precursor, 0.1 to 5% by weight of the poor solvent, and 35 to 69.9% by weight of the good solvent, and then heating the molded composition at 250 DEG to 500 DEG C. to imidate the same.
申请公布号 US5589111(A) 申请公布日期 1996.12.31
申请号 US19950439142 申请日期 1995.05.11
申请人 CHISSO CORPORATION 发明人 HARUTA, HIROSHI;TAKAHASHI, TAKEHIKO
分类号 B29C47/02;B29C67/24;(IPC1-7):B29B9/10;B29C47/88 主分类号 B29C47/02
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