发明名称 |
Lead frame assembly for surface mount integrated circuit power package |
摘要 |
A lead frame package for housing an integrated circuit. A lead frame (11) having a plurality of leads (13) extending from at least three sides of the package. Lead frame (11) is formed having a first region (18), a transition region (19), and a second region (21). A distance between a heat sink (12) and the lead frame (11) may vary. The offset is chosen to compensate for a predetermined distance between the heat sink (12) and the lead frame (11) such that the lead frame (11) aligns to lead frame handling equipment. A single lead frame manufacturing setup can then be used. A slot (22) is formed in the lead frame (11) extending through the second region (21) and the transition region (19) into first area (18) providing a path for injecting an encapsulation material into a mold. |
申请公布号 |
US5587883(A) |
申请公布日期 |
1996.12.24 |
申请号 |
US19950557667 |
申请日期 |
1995.11.13 |
申请人 |
MOTOROLA, INC. |
发明人 |
OLSON, TIMOTHY L.;CARNEY, LAURIANN T.;JOHNSON, GARY C.;STROM, WILLIAM M. |
分类号 |
H01L23/50;H01L23/433;H01L23/48;H01L23/495;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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