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发明名称
MANUFACTURE OF SEMICONDUCTOR PACKAGE
摘要
申请公布号
JPH08335596(A)
申请公布日期
1996.12.17
申请号
JP19950142760
申请日期
1995.06.09
申请人
SONY CORP
发明人
TAKAHASHI HIDEYUKI
分类号
H01L23/28;H01L21/56;(IPC1-7):H01L21/56
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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