发明名称 |
Process and apparatus for forming and testing semiconductor package leads |
摘要 |
A method of forming leads and providing a final test of a semiconductor package including an electronic circuit therein, the package having unformed leads. A forming and testing station is provided including a support for receiving the package, and dies movably positioned adjacent the support for contacting and forming the leads with test equipment connected to the dies. The semiconductor package is positioned on the support, and the leads of the package are contacted with the dies to connect the test equipment to the leads for testing the electronic circuitry in the package and to form the leads with this contacting step as the final manufacturing step.
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申请公布号 |
US5585281(A) |
申请公布日期 |
1996.12.17 |
申请号 |
US19950383141 |
申请日期 |
1995.02.03 |
申请人 |
MOTOROLA, INC. |
发明人 |
TRUHITTE, DARRELL;GOLUBIC, THEODORE R.;SUGAI, MAUREEN |
分类号 |
H01L21/48;H05K13/00;(IPC1-7):H01L23/50;H01L21/60 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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