Polydiglycidylphenyl ethers of alkylene or alkylenoxy chains for use in microelectronics adhesives

摘要

This invention relates to flexible epoxy resins characterized by a low ionic contamination, total chlorine content less than 0.1%. The epoxy resins are liquids at room temperatur, have Tg values when cured of less than or equal to 150 DEG C, have neat resin viscosities of 25,000 cps or less at 25 DEG C, and have a structural composition comprising an oligomeric backbone of alkylene or alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities: in which: the flexible chain is CH2CH2CH2CH2O when r is an integer 1-10; or the flexible chain is CH2CH20 when r is an integer 3-10; or the flexible chain is CH2 when r is an integer 10-20; or ; or in which: the flexible chain is CH2CH2CH2CH2O when q is an integer 1-6; or the flexible chain is CH2CH20 when q is an integer 3-10.