| 摘要 |
PURPOSE: To obtain an epoxy resin for semiconductor sealing use, excellent in soldering heat resistance, reliability to moisture resistance, and fluidity, comprising an epoxy resin, a specific curing agent and a filler. CONSTITUTION: This composition comprises (A) preferably 1 to 10wt.% of an epoxy resin such as a biphenyl type epoxy resin of formula I (R<1> to R<8> are, each, H, a halogen or 1-4C alkyl group), (B) preferably 1 to 7wt.% of a curing agent having a skeleton of formula II ((n) is 0 to 10; M is a monovalent naphtol; N is a divalent naphtol), e.g. a compound of formula III, and (C) preferably 87 to 95wt.% of a filler containing 50wt.% or more of amorphous silica consisting of 99 to 50wt.% of spherical noncrystalline silica having an average particle diameter of 5μm but not exceeding 30μm and 1 to 50wt.%, of spherical noncrystalline silica having an average particle diameter of 3μm or less. The acid index of this composition is 42% or more.
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