| 摘要 |
PURPOSE: To reduce the displacement of both electrodes and a substrate due to thermal expansion by semi-hardening a connection member by applying energy ray and heating and pressurizing the connection member above the activation temperature of the connection member. CONSTITUTION: Both electrodes 4 and 4 are aligned, a connection member 8 is semi-hardened by activation energy ray 3 (primary connection), and heating and pressurization are performed above the activation temperature of a curing agent being blended to the connection member 8 (secondary connection). The primary connection should be performed below the activation temperature to secure the preservation property up to the secondary connection. The connection device has a heating head 1 and a lifter 2 which can be moved vertically. The lifter 2 is at least partially made of a material for transmitting light, for example crystal and glasses. The source of energy ray 3 is located below the lifter 2, thus preventing electrodes 4 and 5 from deviating and achieving an accurate alignment and at the same time easily achieving repairing. |
