发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE: To obtain a semiconductor device employing silicon gel for buffering in which the electric characteristics are protected against deterioration even if moisture intrudes from the outside. CONSTITUTION: An insulating board 32 is secured onto a metal heat plate 31 and a plurality of conductive layers 33 are formed thereon. A light receiving element 34 is bonded onto one conductive layer 33 and a light emitting element 39 is set above the light receiving element 34 while being supported by electrode terminals 35 having lower end parts bonded to the conductive layer 33. A transparent epoxy resin 40 having low moisture transmittance is provided on the optical path between the light emitting element 39 and the light receiving element 34. The metal heat plate 31 is bonded, as a container, to a metal box type case 36 at the lower end opening thereof. A silicon gel 37 for buffering the impact and an epoxy resin 38 are then injected sequentially. The epoxy resin 40 does not pass the water easily and prevents degradation of electric characteristics without lowering the optical transmittance.
申请公布号 JPH08316370(A) 申请公布日期 1996.11.29
申请号 JP19950122494 申请日期 1995.05.22
申请人 YAZAKI CORP 发明人 SAITO MASAYUKI;SUNAYAMA TATSUO
分类号 H01L23/24;H01L23/48;(IPC1-7):H01L23/24 主分类号 H01L23/24
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