| 摘要 |
PURPOSE: To automate the operation for bonding a thin pair wire to the patterned surface of an electronic device, e.g. a semiconductor chip. CONSTITUTION: A semiconductor chip 2 is mounted on a chip set jig 3 and transferred to a bonding position. On the other hand, a thin pair wire 9 is pasted onto a sheet 1 and gripped by means of a wire chucking unit 6. It is then moved on a rail 13 to a bonding position where the end of thin pair wire 9 is aligned with patterns 2b, 2c before bonding is carried out by means of a bonding tool. With such arrangement, bonding operation of the thin pair wire 9 can be automated. Furthermore, highly accurate positioning can be realized by recognizing the position of pattern on the semiconductor chip 2 using a CCD camera 7. |
