| 摘要 |
A semiconductor device provided with a lead terminal having an island at one end, a semiconductor element the lower surface of which is connected to the island, at least one or more wires which connect the upper surface of the semiconductor element to the island, and resin encapsulation section in which the semiconductor element and wires are encapsulated. In the island, a notch is made between the area on which the semiconductor is mounted and the part where the wire is connected. |
