The present invention relates to a package (10) adapted to house an electronic device (12), such as a semiconductor integrated circuit. The package (10) components are comprised of aluminum or an aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages. <MATH>
申请公布号
DE68927296(D1)
申请公布日期
1996.11.07
申请号
DE1989627296
申请日期
1989.09.14
申请人
OLIN CORP., CHESHIRE, CONN., US
发明人
MAHULIKAR, DEEPAK, MERIDEN, CT 06450, US;POPPLEWELL, JAMES, M., GUILDFORD, CT 06437, US