FABRICATION OF LEADS ON SEMICONDUCTOR CONNECTION COMPONENTS

摘要

A substantially continuous layer of a first metal (137) such as copper is provided with strips of a second metal (147) such as gold by selective electroplating of the second metal, or by applying separately formed strips such as lengths of wire. A dielectric support layer (132) is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal continuous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple and economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead portion formed from a precious metal. The leads may incorporate sections of round cross-sectional shape to facilitate engagement by a bonding tool during use of the component.