发明名称 |
Method for water vapor enhanced charged-particle-beam machin ing |
摘要 |
Water vapour enhanced focused particle-beam-machining speeds up the removal of polymer-based dielectric materials from areas surrounding metallic interconnects on integrated circuits while at the same time decreasing the rate of removal of aluminium. Selective material removal protects metal interconnects from machining damage and greatly reduces the time that protective material is exposed to the particle beam. <IMAGE> |
申请公布号 |
AU5445096(A) |
申请公布日期 |
1996.10.30 |
申请号 |
AU19960054450 |
申请日期 |
1996.04.08 |
申请人 |
NORTH CAROLINA STATE UNIVERSITY |
发明人 |
PHILLIP E. RUSSELL;DIETER P. GRIFFIS;GORDON M. SHEDD;TERRENCE J. STARK;JAMES VITARELLI |
分类号 |
C23F4/00;H01J37/305;H01J37/32;H01L21/302;H01L21/3065;H01L21/311;H01L21/3213 |
主分类号 |
C23F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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