MANUFACTURE OF CHIP ELECTRONIC COMPONENT

摘要

PURPOSE: To easily divide in the simple step and to scarcely generate a burr. CONSTITUTION: A board fixing film 25 formed with an adhesive layer 20 is provided, and a ceramic board 12 formed many lateral and longitudinal electronic elements such as resistors is laminated on the layer 20 of the film 25. The surface of the board 12 is coated with wax 26 dissolved in solvent at the ambient temperature by heating it to about it to about 150 deg.C and cooled to the ambient temperature, then the board 12 is heated to remove the solvent 27 in the wax 26 and diced to be divided at each chip electronic component 10.