发明名称 Method for supporting a wafer in a combined wafer support and temperature monitoring device
摘要 A combined wafer support and thermocouple assembly comprising a wafer support basket having a plurality of wafer support fingers, one of which includes a low mass, low heat constant support for supporting a thermocouple against the backside of a wafer positioned on the basket.
申请公布号 US5567909(A) 申请公布日期 1996.10.22
申请号 US19940309305 申请日期 1994.09.20
申请人 APPLIED MATERIALS INC. 发明人 SUGARMAN, MICHAEL N.;BEESELY, MICHAEL;KELSEY, SHANNON J.;STEGER, ROBERT J.
分类号 G01K1/14;H01L21/22;H01L21/31;H01L21/66;H01L21/673;H01L21/677;H01L21/68;(IPC1-7):H01L35/34 主分类号 G01K1/14
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