发明名称 |
Method for supporting a wafer in a combined wafer support and temperature monitoring device |
摘要 |
A combined wafer support and thermocouple assembly comprising a wafer support basket having a plurality of wafer support fingers, one of which includes a low mass, low heat constant support for supporting a thermocouple against the backside of a wafer positioned on the basket.
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申请公布号 |
US5567909(A) |
申请公布日期 |
1996.10.22 |
申请号 |
US19940309305 |
申请日期 |
1994.09.20 |
申请人 |
APPLIED MATERIALS INC. |
发明人 |
SUGARMAN, MICHAEL N.;BEESELY, MICHAEL;KELSEY, SHANNON J.;STEGER, ROBERT J. |
分类号 |
G01K1/14;H01L21/22;H01L21/31;H01L21/66;H01L21/673;H01L21/677;H01L21/68;(IPC1-7):H01L35/34 |
主分类号 |
G01K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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