| 摘要 |
PURPOSE: To avoid the shortcircuit between bonding wire by a method wherein the angle of lead wires made with the intersecting sides of semiconductor integrated circuit chip is specified not to exceed a specific value while the intervals of input.output pad are expanded at the corner parts of the semiconductor integrated circuit chip so as to almost equalize the intervals between the lead wires. CONSTITUTION: Bonding pads 2 are arranged on the periphery of a semiconductor chip 1 so as to die bond the semiconductor chip 1 onto a stage 7 of a lead frame 6. Next, support bars 8 are extended in the diagonal line direction from the corner parts of the stage 7 to arrange multiple inner leads 9 in respective spaces between the support bars 8. When the inner leads 9 and the bonding pads 2 are connected by bonding wires 3, the angle of the bonding wires 3 made with the intersecting sides of the semiconductor chip 1 is specified not to exceed 60 deg. while the intervals of bonding pads is expanded at the corner parts of the semiconductor chip 1 so as to almost equalize the intervals between the bonding wires 8. Accordingly, the shortcircuit between the bonding wires 3 can be avoided. |
