发明名称 |
NEW THROUGH-HOLE PLATED PRINTED CIRCUIT BOARD AND PROCESS FOR MANUFACTURING THE SAME |
摘要 |
<p>Through-hole plated single or multi-layer printed circuit boards (PCB's) are mfd. from a polymeric or ceramic substrate material, opt. provided on both sides with at least one electroconductive layer (by electroplating or electroless plating with metal), by a process providing plating on surfaces not coated with a conductive metal layer and including the through-holes. The process involves (a) pre-treating the substrate surfaces with an oxidising soln. (I); (b) removing residual (I) by rinsing, then treating with a soln. (II) contg. monomer selected from pyrrole, furnane, thiophene or derivs. and (c) transferring to an acid soln. (III) to cuase polymerisation of monomer into an surfaces conductive polymer layer (typically 0.1-10 microns thick). Residual (III)may be removed by rinsing, and galvanic or electroless metallisation carried out. Pref. prior to step (a), the substrate is subjected to a pretreatment of initial and surface prepn. of its non-conductive areas.</p> |
申请公布号 |
KR960014476(B1) |
申请公布日期 |
1996.10.15 |
申请号 |
KR19890072015 |
申请日期 |
1989.11.02 |
申请人 |
BLASBERG OBERFLAECHENTECHNIK GMBH |
发明人 |
HUPE, JURGEN;KRONENBERG, WALTER |
分类号 |
C25D5/56;C08G61/12;C25D5/54;C25D7/00;H01B1/12;H05K3/28;H05K3/42;H05K3/46;(IPC1-7):H05K3/42 |
主分类号 |
C25D5/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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