发明名称 RESIN MOLDING AND MANUFACTURE THEREOF
摘要 PURPOSE: To provide a resin molding in which a netlike material or particularly a netlike material having electrical conductivity is embedded near the surface of the molding and a simple method for manufacturing the same. CONSTITUTION: A resin molding embeds a netlike material near the surface of the molding. The molding is manufactured by disposing a film provided with the netlike material in a mold, then injection molding the melted resin from the material side in the mold, or disposing the material in a cavity having less thermal conductivity in the mold by using the mold formed of a material having less thermal conductivity at the one surface of the cavity for molding the molding than that of the other surface, and then injection molding the melted resin in the mold.
申请公布号 JPH08267499(A) 申请公布日期 1996.10.15
申请号 JP19950099766 申请日期 1995.03.31
申请人 KURARAY CO LTD 发明人 HOSOKAWA TAKAO
分类号 B29C45/14;B29C45/37;B29K105/08;(IPC1-7):B29C45/14 主分类号 B29C45/14
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