MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE: To improve an yield of semiconductor manufacture by reducing generation of foreign matters due to resist coming-off. CONSTITUTION: When a resist pattern is formed on the surface of a semiconductor wafer 1, a high-concentration alkaline having higher concentration than an alkaline solution removing a positive type resist of an exposure part to be used in a developing process is made to be discharged from a nozzle 8 for discharging high concentration solution to the back of the semiconductor wafer 1, thus making this to creep around the surface of the semiconductor wafer 1 so as to solve and remove the positive type resist 4 of the peripheral part of the positive type resist 4 applied on the semiconder wafer 1 so as to reduce generation of foreign matters due to coning-off of the positive type resist 4.